Vacuum Plasma Treater | VacuTEC 2020
Tantec’s VacuTEC 2020 Plasma Treater is designed for the treatment of a large number of different injection molded parts. The VacuTEC offers very fast treatment times and optimum adhesion properties for downstream coating, gluing, painting, and printing applications.
In the treating chamber, a vacuum is built up to between 0,1 and 3 mbar before an electrical discharge is created through the integrated plasma electrode. Treatment cycle times are often short, between 20-120 seconds depending on the material and its formulation.
The VacuTEC is appreciated for its simplicity of operation, reliability in production, and fast process speed. Treating gasses such as argon and oxygen can be applied, but in most cases, this is not necessary due to the high power exposed by the plasma discharge.
VacuTEC uses the advanced Tantec power generator HV-X series as a power supply and specially designed plasma transformer to provide voltage to the plasma electrodes.
|Easy to install and use||Connect to mains power.|
|Fast treatment times||High power impact enables treatment times from 20-120 seconds, depending on the material.|
|Vacuum level||The plasma discharge is active from 0,1 – 3 mbar depending on the application.|
|Process gas||Process gasses such as oxygen and argon can be used, but in most cases, it is not necessary.|
|Process control||The entire plasma process is controlled by the HV-X generator and the PLC unit. All parameters are displayed through the touch panel.|
|Cost-efficient surface treatment||Due to the low power consumption and no need for special treatment gasses the unit is a very cost-efficient solution for improving surface wettability and adhesion.|
|Vacuum pressure Plasma||Enables treatment of both conductive and non-conductive surfaces.|
|Chamber door||Hinged door with window and safety switch.|
|Technical Specifications||VacuTEC 2020 | Vacuum Plasma Treater|
|Mains voltage and frequency||100-480 VAC 50/60 Hz|
|Output voltage/plasma power||Max. 350 Vp/max. 350 Watt|
|Power source||Standard HV-X generator|
|Compressed air inlet||3 bar dry & clean|
|Treatment gas||Standard: air, oxygen, argon, nitrogen on request|
|Vacuum pump capacity in m³/min.||50 m³/min., others on request|
|Vacuum level||0,1–3 mbar|
|Evacuation time, typical||22 seconds – 1 mbar|
|Plasma treatment time, typical||20–120 seconds, depending on the material|
|Control and connectivity||Complete with the Tantec touch panel.|
|Regulation compliance||CE – RoHS – WEEE|
|Dimensions||752 x 503 x 432 mm|
|Max. treatment height||105 mm|
|Tray size||200 x 200 mm|