Vacuum treating chamber | VacuTEC

Tantec´s VacuTEC Plasma Treater is designed for plasma treatment of a large number of different injection molded parts.

The VacuTEC is available with both single and multiple tray configuration.

The VacuTEC offers very fast treatment times and optimum adhesion properties for downstream coating, gluing, painting, and printing applications. In the vacuum treating chamber, a vacuum is built up to between 2 and 12 mbar before an electrical discharge is created through the integrated plasma electrode. Treatment cycle times are often short, between 2-120 seconds depending on the material and its formulation.

The VacuTEC is appreciated for its simplicity of operation, reliability in production, and fast process speed. Treating gasses such as argon and oxygen can be applied, but in most cases, this is not necessary due to the high power exposed by the plasma discharge.

VacuTEC uses the advanced Tantec power generator HV-X series as a power supply and specially designed plasma transformers to provide voltage to the plasma electrodes.


Excellent reliability was the key difference in new investments of Tantecs solution

Vacuum plasma treatment greatly improves adhesion for leading car manufacturer

Improved adhesion for one of the largest manufacturers of ski bindings

Technial specifications

Easy to install and useConnects to mains power and compressed air.
Fast treatment timesHigh power impact enables treatment times from 20-180 seconds, depending on the material.
Standard or customized chambersChamber and part trays can be designed for most applications. Many available as standard.
Vacuum levelThe plasma discharge is active from 1-12 mbar depending on the application.
Process gasProcess gasses such as oxygen and argon can be used, but in most cases, it is not necessary.
Process controlThe entire plasma process is controlled by the HV-X generator and the PLC unit. All parameters are displayed through the touch panel. (Standard – Proface).
Cost-efficient surface treatmentDue to the low power consumption and no need for special treatment gasses, the unit is a very cost-efficient solution for improving surface wettability and adhesion.
Vacuum pressure PlasmaEnables treatment of both conductive and non-conductive surfaces.
Chamber doorsStandard doors with a manual opening or automatic motor-driven doors available.

Technical SpecificationsVacuTEC Vacuum Plasma Treater
Mains voltage and frequency100-480 VAC 50/60 Hz
Output voltage/plasma powerMax. 400 Vp/max. 2000 Watt
Power supplyHV-X plasma generator series
Compressed air inlet5–6 bar dry & clean
Process gasStandard: air, oxygen, argon, nitrogen on request
Vacuum pump capacity in m³/min.15 to 240 m³/min., depending on the size of the vacuum chamber, others on request
Vacuum level1–12 mbar
Evacuation time, typical15-60 seconds, depending on chamber size and pump capacity
Plasma treatment time, typical20–180 seconds, depending on the material
Control and connectivityComplete with touch panel. (Standard – Proface)
Regulation complianceCE – RoHS – WEEE
lars tantec

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