Vacuum treating chamber | VacuTEC
Tantec´s VacuTEC Plasma Treater is designed for plasma treatment of a large number of different injection molded parts.
The VacuTEC is available with both single and multiple tray configuration.
The VacuTEC offers very fast treatment times and optimum adhesion properties for downstream coating, gluing, painting, and printing applications. In the vacuum treating chamber, a vacuum is built up to between 2 and 12 mbar before an electrical discharge is created through the integrated plasma electrode. Treatment cycle times are often short, between 2-120 seconds depending on the material and its formulation.
The VacuTEC is appreciated for its simplicity of operation, reliability in production, and fast process speed. Treating gasses such as argon and oxygen can be applied, but in most cases, this is not necessary due to the high power exposed by the plasma discharge.
VacuTEC uses the advanced Tantec power generator HV-X series as a power supply and specially designed plasma transformers to provide voltage to the plasma electrodes.
Cases
Technial specifications
| FEATURES: | |
| Easy to install and use | Connects to mains power and compressed air. |
| Fast treatment times | High power impact enables treatment times from 20-180 seconds, depending on the material. |
| Standard or customized chambers | Chamber and part trays can be designed for most applications. Many available as standard. |
| Vacuum level | The plasma discharge is active from 1-12 mbar depending on the application. |
| Process gas | Process gasses such as oxygen and argon can be used, but in most cases, it is not necessary. |
| Process control | The entire plasma process is controlled by the HV-X generator and the PLC unit. All parameters are displayed through the touch panel. (Standard – Proface). |
| Cost-efficient surface treatment | Due to the low power consumption and no need for special treatment gasses, the unit is a very cost-efficient solution for improving surface wettability and adhesion. |
| Vacuum pressure Plasma | Enables treatment of both conductive and non-conductive surfaces. |
| Chamber doors | Standard doors with a manual opening or automatic motor-driven doors available. |
| Technical Specifications | VacuTEC Vacuum Plasma Treater |
| Mains voltage and frequency | 100-480 VAC 50/60 Hz |
| Output voltage/plasma power | Max. 400 Vp/max. 2000 Watt |
| Power supply | HV-X plasma generator series |
| Compressed air inlet | 5–6 bar dry & clean |
| Process gas | Standard: air, oxygen, argon, nitrogen on request |
| Vacuum pump capacity in m³/min. | 15 to 240 m³/min., depending on the size of the vacuum chamber, others on request |
| Vacuum level | 1–12 mbar |
| Evacuation time, typical | 15-60 seconds, depending on chamber size and pump capacity |
| Plasma treatment time, typical | 20–180 seconds, depending on the material |
| Control and connectivity | Complete with touch panel. (Standard – Proface) |
| Regulation compliance | CE – RoHS – WEEE |